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Conference contributions
Die thickness impact on thermo-mechanical stress in 3D packages
Publication:
Die thickness impact on thermo-mechanical stress in 3D packages
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Date
2015
Proceedings Paper
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30750.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Salahouelhadj, Abdellah
;
Gonzalez, Mario
;
Oprins, Herman
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Acq. date: 2025-12-15
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Views
1907
since deposited on 2021-10-22
1
last month
1
last week
Acq. date: 2025-12-15
Citations