Publication:

Die thickness impact on thermo-mechanical stress in 3D packages

Date

2015
Proceedings Paper
Simple item page Full metadata Statistics
 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-4374-4854
cris.virtual.orcid0000-0003-0680-4969
cris.virtual.orcid0000-0002-3795-1446
cris.virtualsource.departmentb98b120a-aea4-4c29-835f-6fae89301f2f
cris.virtualsource.departmente2b142d3-d92c-4859-9ac7-498d018fed07
cris.virtualsource.department1591967b-5bad-4095-ad1e-2b9c2aee2fe3
cris.virtualsource.orcidb98b120a-aea4-4c29-835f-6fae89301f2f
cris.virtualsource.orcide2b142d3-d92c-4859-9ac7-498d018fed07
cris.virtualsource.orcid1591967b-5bad-4095-ad1e-2b9c2aee2fe3
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorOprins, Herman
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorOprins, Herman
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.date.accessioned2021-10-22T22:29:22Z
dc.date.available2021-10-22T22:29:22Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25853
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7103104
dc.source.beginpage1
dc.source.conference16th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate19/04/2015
dc.source.conferencelocationBudapest Hungary
dc.source.endpage6
dc.title

Die thickness impact on thermo-mechanical stress in 3D packages

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
30750.pdf
Size:
1.68 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions