Publication:

Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below

Date

2022-06-29
Proceedings Paper
https://doi.org/10.1109/IITC52079.2022.9881321
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dc.contributor.authorMontero Alvarez, Daniel
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorFeurprier, Yannick
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorOikawa, Noriaki
dc.contributor.authorMartinez Alanis, Gerardo Tadeo
dc.contributor.authorBatuk, Dmitry
dc.contributor.authorPuliyalil, Harinarayanan
dc.contributor.authorVersluijs, Janko
dc.contributor.authorDe Coster, Hanne
dc.contributor.authorBazzazian, Nina
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorKumar, Kaushik
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorPark, Seongho
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorMontero Alvarez, Daniel
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorFeurprier, Yannick
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorOikawa, Noriaki
dc.contributor.imecauthorMartinez Alanis, Gerardo Tadeo
dc.contributor.imecauthorBatuk, Dmitry
dc.contributor.imecauthorPuliyalil, Harinarayanan
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorDe Coster, Hanne
dc.contributor.imecauthorBazzazian, Nina
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorKumar, Kaushik
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorPark, Seongho
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecMontero Alvarez, Daniel::0000-0001-9966-0399
dc.contributor.orcidimecVega Gonzalez, Victor::0000-0002-4320-0585
dc.contributor.orcidimecVarela Pedreira, Olalla::0000-0002-2987-1972
dc.contributor.orcidimecMartinez Alanis, Gerardo Tadeo::0000-0001-5036-0491
dc.contributor.orcidimecBatuk, Dmitry::0000-0002-6384-6690
dc.contributor.orcidimecPuliyalil, Harinarayanan::0000-0002-9749-5307
dc.contributor.orcidimecDe Coster, Hanne::0000-0002-5968-7703
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecJourdan, Nicolas::0009-0005-4798-1736
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.date.accessioned2024-04-09T08:33:55Z
dc.date.available2022-11-23T13:52:23Z
dc.date.available2024-04-09T08:33:55Z
dc.date.embargo2023-01-01
dc.date.issued2022-06-29
dc.identifier.doi10.1109/IITC52079.2022.9881321
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40771
dc.source.conferenceIITC2022
dc.source.conferencedate2022-06-27
dc.source.conferencelocationSan Jose
dc.subject.disciplineApplied physics
dc.subject.keywordshigh-aspect ratio via
dc.subject.keywordssupervia
dc.subject.keywordsBEOL interconnect
dc.subject.keywords3nm node
dc.subject.keywordsscaling booster
dc.title

Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below

dc.typeProceedings paper
dspace.entity.typePublication
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