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Articles
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails
Publication:
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails
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Date
2022
Journal article
https://doi.org/10.1109/TED.2022.3205561
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Veloso, Anabela
;
Jourdain, Anne
;
Radisic, Dunja
;
Chen, Rongmei
;
Arutchelvan, Goutham
;
O'Sullivan, Barry
;
Arimura, Hiroaki
;
Stucchi, Michele
;
De Keersgieter, An
;
Hosseini, Maryam
;
Hopf, Toby
;
D'have, Koen
;
Wang, Shouhua
;
Dupuy, Emmanuel
;
Mannaert, Geert
;
Vandersmissen, Kevin
;
Iacovo, Serena
;
Marien, Philippe
;
Choudhury, Subhobroto
;
Schleicher, Filip
;
Sebaai, Farid
;
Oniki, Yusuke
;
Zhou, X.
;
Gupta, Anshul
;
Schram, Tom
;
Briggs, Basoene
;
Lorant, Christophe
;
Rosseel, Erik
;
Hikavyy, Andriy
;
Loo, Roger
;
Geypen, Jef
;
Batuk, Dmitry
;
Martinez Alanis, Gerardo Tadeo
;
Soulie, Jean-Philippe
;
Devriendt, Katia
;
Chan, BT
;
Demuynck, Steven
;
Hiblot, Gaspard
;
Van der Plas, Geert
;
Ryckaert, Julien
;
Beyer, Gerald
;
Dentoni Litta, Eugenio
;
Beyne, Eric
;
Horiguchi, Naoto
Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
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1664
since deposited on 2022-10-15
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last month
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Acq. date: 2025-12-15
Citations
Metrics
Views
1664
since deposited on 2022-10-15
3
last month
2
last week
Acq. date: 2025-12-15
Citations