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Conference contributions
Reliability characterization of thermal micro-structures implemented on 0.8 mu m CMOS chips
Publication:
Reliability characterization of thermal micro-structures implemented on 0.8 mu m CMOS chips
Date
2000
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sheng, L. Y.
;
De Tandt, Cathleen
;
Ranson, Willy
;
Vounckx, Roger
Journal
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1927
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1927
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations