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Seed layer and multistack approaches to reduce leakage in SrTiO3-based metal-insulator-metal capacitors using TiN bottom electrode
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1825 since deposited on 2021-10-18
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Acq. date: 2026-08-06
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1825 since deposited on 2021-10-18
1last month
1last week
Acq. date: 2026-08-06
Citations