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Seed layer and multistack approaches to reduce leakage in SrTiO3-based metal-insulator-metal capacitors using TiN bottom electrode

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dc.contributor.authorMenou, Nicolas
dc.contributor.authorPopovici, Mihaela Ioana
dc.contributor.authorOpsomer, Karl
dc.contributor.authorKaczer, Ben
dc.contributor.authorPawlak, Malgorzata
dc.contributor.authorAdelmann, Christoph
dc.contributor.authorFranquet, Alexis
dc.contributor.authorFavia, Paola
dc.contributor.authorBender, Hugo
dc.contributor.authorDetavernier, Christophe
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorWouters, Dirk
dc.contributor.authorBiesemans, Serge
dc.contributor.authorKittl, Jorge
dc.contributor.imecauthorPopovici, Mihaela Ioana
dc.contributor.imecauthorOpsomer, Karl
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorFavia, Paola
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorBiesemans, Serge
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecFavia, Paola::0000-0002-1019-3497
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.accessioned2021-10-18T19:03:15Z
dc.date.available2021-10-18T19:03:15Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.issn0021-4922
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17618
dc.source.beginpage04DD01
dc.source.issue4
dc.source.journalJapanese Journal of Applied Physics
dc.source.volume49
dc.title

Seed layer and multistack approaches to reduce leakage in SrTiO3-based metal-insulator-metal capacitors using TiN bottom electrode

dc.typeJournal article
dspace.entity.typePublication
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