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Fabrication of 100 nm pitch copper interconnects by electron beam lithography
Publication:
Fabrication of 100 nm pitch copper interconnects by electron beam lithography
Date
2004
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wu, Wen
;
Jonckheere, Rik
;
Tokei, Zsolt
;
Brongersma, Sywert
;
Van Hove, Marleen
;
Maex, Karen
Journal
Journal of Vacuum Science and Technology B
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1901
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
Metrics
Views
1901
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations