Publication:

Fabrication of 100 nm pitch copper interconnects by electron beam lithography

Date

2004
Journal article
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dc.contributor.authorWu, Wen
dc.contributor.authorJonckheere, Rik
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorJonckheere, Rik
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecJonckheere, Rik::0000-0003-2211-9443
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned2021-10-15T18:02:31Z
dc.date.available2021-10-15T18:02:31Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9940
dc.source.beginpageL11
dc.source.endpageL14
dc.source.issue4
dc.source.journalJournal of Vacuum Science and Technology B
dc.source.volume22
dc.title

Fabrication of 100 nm pitch copper interconnects by electron beam lithography

dc.typeJournal article
dspace.entity.typePublication
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