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Conference contributions
Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes
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Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes
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Date
2015
Proceedings Paper
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30654.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Guo, Wei
;
Karmarkar, Aditya
;
Xu, Xiaopeng
;
Van der Plas, Geert
;
Van Huylenbroeck, Stefaan
;
Gonzalez, Mario
;
Absil, Philippe
;
El Sayed, Karim
;
Beyne, Eric
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1906
since deposited on 2021-10-22
Acq. date: 2026-01-24
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Views
1906
since deposited on 2021-10-22
Acq. date: 2026-01-24
Citations