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Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration
Publication:
Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration
Date
2022
Proceedings Paper
https://doi.org/10.1109/ECTC51906.2022.00244
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jourdain, Anne
;
Stucchi, Michele
;
Van Der Plas, Geert
;
Beyer, Gerald
;
Beyne, Eric
Journal
na
Abstract
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1823
since deposited on 2022-09-17
Acq. date: 2025-10-28
Citations
Metrics
Views
1823
since deposited on 2022-09-17
Acq. date: 2025-10-28
Citations