Publication:

Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration

Date

2022
Proceedings Paper
https://doi.org/10.1109/ECTC51906.2022.00244
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dc.contributor.authorJourdain, Anne
dc.contributor.authorStucchi, Michele
dc.contributor.authorVan Der Plas, Geert
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVan Der Plas, Geert
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2023-01-05T12:39:17Z
dc.date.available2022-09-17T02:52:04Z
dc.date.available2023-01-05T12:39:17Z
dc.date.issued2022
dc.identifier.doi10.1109/ECTC51906.2022.00244
dc.identifier.eisbn978-1-6654-7943-1
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40438
dc.publisherIEEE
dc.source.beginpage1531
dc.source.conference72nd IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 31-JUN 01, 2022
dc.source.conferencelocationSan Diego
dc.source.endpage1538
dc.source.journalna
dc.source.numberofpages8
dc.title

Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration

dc.typeProceedings paper
dspace.entity.typePublication
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