Publication:

3D sequential CMOS top tier devices demonstration using a low temperature Smart Cu (TM) Si layer transfer

Date

2021

Proceedings Paper

https://doi.org/10.1109/SNW51795.2021.00025

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Author(s)

Besnard, Guillaume

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;

Vandooren, Anne

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;

;

;

Arimura, Hiroaki

;

Mannaert, Geert

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;

Hikavyy, Andriy

;

Dentoni Litta, Eugenio

;

Horiguchi, Naoto

Journal

na

Statistics

1962 since deposited on 2022-03-16

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Acq. date: 2026-05-16