Publication:
3D sequential CMOS top tier devices demonstration using a low temperature Smart Cu (TM) Si layer transfer
| dc.contributor.author | Besnard, Guillaume | |
| dc.contributor.author | Radu, Ionut | |
| dc.contributor.author | Vandooren, Anne | |
| dc.contributor.author | Wu, Zhicheng | |
| dc.contributor.author | Franco, Jacopo | |
| dc.contributor.author | Li, Waikin | |
| dc.contributor.author | Arimura, Hiroaki | |
| dc.contributor.author | Mannaert, Geert | |
| dc.contributor.author | Rosseel, Erik | |
| dc.contributor.author | Hikavyy, Andriy | |
| dc.contributor.author | Dentoni Litta, Eugenio | |
| dc.contributor.author | Horiguchi, Naoto | |
| dc.contributor.imecauthor | Vandooren, Anne | |
| dc.contributor.imecauthor | Wu, Zhicheng | |
| dc.contributor.imecauthor | Franco, Jacopo | |
| dc.contributor.imecauthor | Li, Waikin | |
| dc.contributor.imecauthor | Arimura, Hiroaki | |
| dc.contributor.imecauthor | Mannaert, Geert | |
| dc.contributor.imecauthor | Rosseel, Erik | |
| dc.contributor.imecauthor | Hikavyy, Andriy | |
| dc.contributor.imecauthor | Dentoni Litta, Eugenio | |
| dc.contributor.imecauthor | Horiguchi, Naoto | |
| dc.contributor.orcidimec | Franco, Jacopo::0000-0002-7382-8605 | |
| dc.contributor.orcidimec | Hikavyy, Andriy::0000-0002-8201-075X | |
| dc.contributor.orcidimec | Horiguchi, Naoto::0000-0001-5490-0416 | |
| dc.contributor.orcidimec | Vandooren, Anne::0000-0002-2412-0176 | |
| dc.contributor.orcidimec | Dentoni Litta, Eugenio::0000-0003-0333-376X | |
| dc.date.accessioned | 2022-03-16T13:18:18Z | |
| dc.date.available | 2022-03-16T13:18:18Z | |
| dc.date.issued | 2021 | |
| dc.identifier.doi | 10.1109/SNW51795.2021.00025 | |
| dc.identifier.eisbn | 978-4-86348-781-9 | |
| dc.identifier.issn | 2161-4636 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39447 | |
| dc.publisher | IEEE, ELECTRON DEVICES SOC & RELIABILITY GROUP | |
| dc.source.beginpage | 47 | |
| dc.source.conference | 26th Silicon Nanoelectronics Workshop | |
| dc.source.conferencedate | JUN 13, 2021 | |
| dc.source.conferencelocation | Virtual | |
| dc.source.endpage | 48 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 2 | |
| dc.title | 3D sequential CMOS top tier devices demonstration using a low temperature Smart Cu (TM) Si layer transfer | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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