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Articles
Sub-resolution feature OPC as an enabler for manufacturing at 0.2 μm and below
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Sub-resolution feature OPC as an enabler for manufacturing at 0.2 μm and below
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Date
1998
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Randall, John
;
Tritchkov, Alexander
;
Ronse, Kurt
;
Jaenen, Patrick
Journal
Microelectronic Engineering
Abstract
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Downloads
1
since deposited on 2021-10-01
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1933
since deposited on 2021-10-01
1
last month
1
last week
Acq. date: 2026-02-25
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