Publication:

Sub-resolution feature OPC as an enabler for manufacturing at 0.2 μm and below

Date

1998
Journal article
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-0803-4267
cris.virtualsource.department39296602-be4d-4e18-afa8-ee84a98173fd
cris.virtualsource.department987ea135-86ab-40b5-a86e-f94391ccf5fe
cris.virtualsource.orcid39296602-be4d-4e18-afa8-ee84a98173fd
cris.virtualsource.orcid987ea135-86ab-40b5-a86e-f94391ccf5fe
dc.contributor.authorRandall, John
dc.contributor.authorTritchkov, Alexander
dc.contributor.authorRonse, Kurt
dc.contributor.authorJaenen, Patrick
dc.contributor.imecauthorRonse, Kurt
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.orcidimecRonse, Kurt::0000-0003-0803-4267
dc.date.accessioned2021-10-01T08:46:11Z
dc.date.available2021-10-01T08:46:11Z
dc.date.embargo9999-12-31
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2896
dc.source.beginpage83
dc.source.endpage86
dc.source.journalMicroelectronic Engineering
dc.source.volume41/42
dc.title

Sub-resolution feature OPC as an enabler for manufacturing at 0.2 μm and below

dc.typeJournal article
dspace.entity.typePublication
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