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CMP of a RU based layer in an advanced Cu low-k stack

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dc.contributor.authorVaes, Jan
dc.contributor.authorSinapi, Fabrice
dc.contributor.authorHernandez, Jose Luis
dc.contributor.authorSantoro, Gaetano
dc.contributor.authorNguyen, Olivier
dc.contributor.authorWang, James
dc.contributor.imecauthorHernandez, Jose Luis
dc.contributor.imecauthorSantoro, Gaetano
dc.date.accessioned2021-10-16T20:22:54Z
dc.date.available2021-10-16T20:22:54Z
dc.date.issued2007-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13008
dc.source.beginpage43
dc.source.conferenceInternational Conference on Planarization CMP Technology - ICPT
dc.source.conferencedate25/10/2007
dc.source.conferencelocationDresden Germany
dc.source.endpage48
dc.title

CMP of a RU based layer in an advanced Cu low-k stack

dc.typeProceedings paper
dspace.entity.typePublication
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