Publication:

On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control

Date

2016
Proceedings Paper
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dc.contributor.authorTokei, Zsolt
dc.contributor.authorCiofi, Ivan
dc.contributor.authorRoussel, Philippe
dc.contributor.authorDebacker, Peter
dc.contributor.authorRaghavan, Praveen
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorWilson, Chris
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorAdelmann, Christoph
dc.contributor.authorWen, Liang Gong
dc.contributor.authorCroes, Kristof
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorMoors, Kristof
dc.contributor.authorKrishtab, Mikhail
dc.contributor.authorArmini, Silvia
dc.contributor.authorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorDebacker, Peter
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorKrishtab, Mikhail
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
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dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2021-10-23T15:35:34Z
dc.date.available2021-10-23T15:35:34Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27397
dc.source.beginpage181
dc.source.conferenceSymposium on VLSI Technology
dc.source.conferencedate13/06/2016
dc.source.conferencelocationHonolulu, HI USA
dc.source.endpage182
dc.title

On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control

dc.typeProceedings paper
dspace.entity.typePublication
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