Publication:

Impact of the device geometric parameters on hot-carrier degradation in FinFETs

Date

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-9940-0260
cris.virtual.orcid0000-0001-8434-1838
cris.virtual.orcid0000-0002-9927-6511
cris.virtual.orcid0000-0003-1615-1033
cris.virtual.orcid0000-0002-1484-4007
cris.virtual.orcid0000-0002-5376-2119
cris.virtual.orcid0000-0002-5348-2096
cris.virtualsource.department8fc98104-5797-4ad7-ab96-253e6c50458d
cris.virtualsource.department63eea5a8-b81a-4bb2-aa67-715ba610971a
cris.virtualsource.department73cfbc15-31c4-40b7-a380-137fb1f6ed34
cris.virtualsource.departmentf5422aad-241b-410a-a7b7-28bf124c06e0
cris.virtualsource.department812f2909-a81b-4593-9b32-75331cffa35c
cris.virtualsource.departmentcd811942-aea0-4312-8eb5-d9cc179a6b3d
cris.virtualsource.departmentf3759903-e615-46a5-8efa-11f3aef05ef3
cris.virtualsource.orcid8fc98104-5797-4ad7-ab96-253e6c50458d
cris.virtualsource.orcid63eea5a8-b81a-4bb2-aa67-715ba610971a
cris.virtualsource.orcid73cfbc15-31c4-40b7-a380-137fb1f6ed34
cris.virtualsource.orcidf5422aad-241b-410a-a7b7-28bf124c06e0
cris.virtualsource.orcid812f2909-a81b-4593-9b32-75331cffa35c
cris.virtualsource.orcidcd811942-aea0-4312-8eb5-d9cc179a6b3d
cris.virtualsource.orcidf3759903-e615-46a5-8efa-11f3aef05ef3
dc.contributor.authorTyaginov, Stanislav
dc.contributor.authorMakarov, Alexander
dc.contributor.authorKaczer, Ben
dc.contributor.authorJech, Markus
dc.contributor.authorVaisman Chasin, Adrian
dc.contributor.authorGrill, Alexander
dc.contributor.authorHellings, Geert
dc.contributor.authorVexler, Mikhail
dc.contributor.authorLinten, Dimitri
dc.contributor.authorGrasser, Tibor
dc.contributor.imecauthorTyaginov, Stanislav
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorVaisman Chasin, Adrian
dc.contributor.imecauthorGrill, Alexander
dc.contributor.imecauthorHellings, Geert
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.contributor.orcidimecVaisman Chasin, Adrian::0000-0002-9940-0260
dc.contributor.orcidimecGrill, Alexander::0000-0003-1615-1033
dc.contributor.orcidimecHellings, Geert::0000-0002-5376-2119
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.date.accessioned2021-10-26T06:07:26Z
dc.date.available2021-10-26T06:07:26Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.issn1063-7826
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31987
dc.identifier.urlhttps://link.springer.com/article/10.1134/S1063782618130183
dc.source.beginpage1738
dc.source.endpage1742
dc.source.issue13
dc.source.journalSemiconductors
dc.source.volume52
dc.title

Impact of the device geometric parameters on hot-carrier degradation in FinFETs

dc.typeJournal article
dspace.entity.typePublication
Files

Original bundle

Name:
40692.pdf
Size:
545.42 KB
Format:
Adobe Portable Document Format
Publication available in collections: