Publication:

Enabling interconnect scaling with spacer-defined double patterning (SDDP)

Date

2013
Journal article
Simple item page Full metadata Statistics
 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0009-0001-0376-866X
cris.virtual.orcid0000-0002-7848-0492
cris.virtual.orcid0009-0004-1634-4163
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-0402-8225
cris.virtual.orcid0000-0003-3545-3424
cris.virtualsource.departmentdb4eab77-b2c2-4b0a-9f2f-dc463d9fcfab
cris.virtualsource.department6bdcc60f-7ae5-42d4-addd-85ee458d77ce
cris.virtualsource.department591222cb-e0fc-431a-af95-8996f52ba3cb
cris.virtualsource.department81375c71-3fff-42d4-b453-da08e56f09f4
cris.virtualsource.department0c41ddf8-651a-4081-a5f1-41a81ff84db7
cris.virtualsource.departmentf2e648b4-91e6-42de-bb5d-66326414095e
cris.virtualsource.department5345513e-14d5-47e9-a494-1dda4ed18864
cris.virtualsource.orciddb4eab77-b2c2-4b0a-9f2f-dc463d9fcfab
cris.virtualsource.orcid6bdcc60f-7ae5-42d4-addd-85ee458d77ce
cris.virtualsource.orcid591222cb-e0fc-431a-af95-8996f52ba3cb
cris.virtualsource.orcid81375c71-3fff-42d4-b453-da08e56f09f4
cris.virtualsource.orcid0c41ddf8-651a-4081-a5f1-41a81ff84db7
cris.virtualsource.orcidf2e648b4-91e6-42de-bb5d-66326414095e
cris.virtualsource.orcid5345513e-14d5-47e9-a494-1dda4ed18864
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorStucchi, Michele
dc.contributor.authorVersluijs, Janko
dc.contributor.authorRoussel, Philippe
dc.contributor.authorKunnen, Eddy
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.date.accessioned2021-10-21T12:03:00Z
dc.date.available2021-10-21T12:03:00Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23081
dc.source.beginpage116
dc.source.endpage120
dc.source.journalMicroelectronic Engineering
dc.source.volume112
dc.title

Enabling interconnect scaling with spacer-defined double patterning (SDDP)

dc.typeJournal article
dspace.entity.typePublication
Files

Original bundle

Name:
23362.pdf
Size:
1.86 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Articles