Publication:

Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies

Date

2021
Proceedings Paper
https://doi.org/10.1109/ICICDT51558.2021.9626482
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dc.contributor.authorFranco, Jacopo
dc.contributor.authorArimura, Hiroaki
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorVandooren, Anne
dc.contributor.authorRagnarsson, Lars-Ake
dc.contributor.authorWu, Z.
dc.contributor.authorClaes, D.
dc.contributor.authorDentoni Litta, Eugenio
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorCroes, Kristof
dc.contributor.authorLinten, Dimitri
dc.contributor.authorGrasser, T.
dc.contributor.authorKaczer, Ben
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorArimura, Hiroaki
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorRagnarsson, Lars-Ake
dc.contributor.imecauthorDentoni Litta, Eugenio
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorKaczer, Ben
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecRagnarsson, Lars-Ake::0000-0003-1057-8140
dc.contributor.orcidimecDentoni Litta, Eugenio::0000-0003-0333-376X
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.date.accessioned2022-11-17T14:44:56Z
dc.date.available2022-09-19T02:51:16Z
dc.date.available2022-11-17T14:44:56Z
dc.date.issued2021
dc.identifier.doi10.1109/ICICDT51558.2021.9626482
dc.identifier.eisbn978-1-6654-4998-4
dc.identifier.issn2381-3555
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40462
dc.publisherIEEE
dc.source.conferenceInternational Conference on IC Design and Technology (ICICDT)
dc.source.conferencedateSEP 15-17, 2021
dc.source.conferencelocationDresden, Germany
dc.source.journalna
dc.source.numberofpages4
dc.title

Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies

dc.typeProceedings paper
dspace.entity.typePublication
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