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Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer
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Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer
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Date
2023
Proceedings Paper
https://doi.org/10.1109/ECTC51909.2023.00184
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kwak, Ji-Youn
;
Chery, Emmanuel
;
Bertheau, Julien
;
Slabbekoorn, John
;
De Messemaeker, Joke
;
Beyne, Eric
Journal
N/A
Abstract
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746
since deposited on 2023-10-23
Acq. date: 2025-12-15
Citations
Metrics
Views
746
since deposited on 2023-10-23
Acq. date: 2025-12-15
Citations