Publication:
Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer
| dc.contributor.author | Kwak, Ji-Youn | |
| dc.contributor.author | Chery, Emmanuel | |
| dc.contributor.author | Bertheau, Julien | |
| dc.contributor.author | Slabbekoorn, John | |
| dc.contributor.author | De Messemaeker, Joke | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Chery, Emmanuel | |
| dc.contributor.imecauthor | Bertheau, Julien | |
| dc.contributor.imecauthor | Slabbekoorn, John | |
| dc.contributor.imecauthor | De Messemaeker, Joke | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Chery, Emmanuel::0000-0002-2526-3873 | |
| dc.contributor.orcidimec | Slabbekoorn, John::0000-0002-6098-8618 | |
| dc.contributor.orcidimec | De Messemaeker, Joke::0000-0002-4872-0176 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2024-06-04T09:26:45Z | |
| dc.date.available | 2023-10-23T17:27:42Z | |
| dc.date.available | 2024-06-04T09:26:45Z | |
| dc.date.issued | 2023 | |
| dc.description.wosFundingText | The authors would like to express their gratitude to the different imec teams involved in this study. Contributions from imec's 3D IIAP program are deeply acknowledged. Special thanks for the numerous FIB cross-section requests handled by Dr. Olivier Richard and Ms. Chris Drijbooms. Part of this research was supported by the MOTIE (Ministry of Trade, Industry, and Energy) in Korea, under the Fostering Global Talents for Innovative Growth Program (P0017312) supervised by the Korea Institute for Advancement of Technology (KIAT). | |
| dc.identifier.doi | 10.1109/ECTC51909.2023.00184 | |
| dc.identifier.eisbn | 979-8-3503-3498-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42918 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 1080 | |
| dc.source.conference | IEEE 73rd Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 30-JUN 02, 2023 | |
| dc.source.conferencelocation | Orlando | |
| dc.source.endpage | 1084 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 5 | |
| dc.title | Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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