Publication:

Stress simulations of Si- and Ge-channel FinFETs for the 14 nm-node and beyond

Date

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-8201-075X
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-3994-8021
cris.virtual.orcid0000-0002-1019-3497
cris.virtual.orcid0000-0002-7422-079X
cris.virtual.orcid0000-0001-5490-0416
cris.virtual.orcid0000-0002-0772-5501
cris.virtual.orcid0000-0002-8062-3165
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-5849-3384
cris.virtual.orcid0000-0003-3513-6058
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-5527-8582
cris.virtualsource.departmentcafd0f9c-62ee-4fbc-b736-eb19e43687ce
cris.virtualsource.departmentaa278ea5-787e-4cf9-b811-072acf5b1d4d
cris.virtualsource.department66017fdc-05d4-4021-a802-f1ff7b4721d3
cris.virtualsource.departmentc04a45aa-af45-4b45-b54e-dd767c676d15
cris.virtualsource.department0456add5-17a2-494d-a511-a1a88de8c603
cris.virtualsource.departmentdf8401d6-bf8a-4030-b504-322d3c8b038d
cris.virtualsource.department01b1b8a7-9b04-47c3-bbbc-9009b4f588ea
cris.virtualsource.department821dc741-8843-4d53-8e1d-6f543228a740
cris.virtualsource.department9f04b13f-f81c-4d48-a5bd-0b2cb5210392
cris.virtualsource.departmentd5d1324e-5341-4c0d-aa41-3c1039907db9
cris.virtualsource.departmentc807a03a-358d-4274-b622-dee889a60454
cris.virtualsource.department7f1ede79-794c-4ed6-ba2c-ed759bfbcc5a
cris.virtualsource.departmentdb73cf2d-2000-429c-bc92-553a1ef3e876
cris.virtualsource.department2d7dd015-fa43-4fbb-89fc-68f144075506
cris.virtualsource.departmentbd265d49-9bfb-424d-adea-35c86526f50d
cris.virtualsource.department63d46233-e95e-4a8f-b99d-4404b9546461
cris.virtualsource.orcidcafd0f9c-62ee-4fbc-b736-eb19e43687ce
cris.virtualsource.orcidaa278ea5-787e-4cf9-b811-072acf5b1d4d
cris.virtualsource.orcid66017fdc-05d4-4021-a802-f1ff7b4721d3
cris.virtualsource.orcidc04a45aa-af45-4b45-b54e-dd767c676d15
cris.virtualsource.orcid0456add5-17a2-494d-a511-a1a88de8c603
cris.virtualsource.orciddf8401d6-bf8a-4030-b504-322d3c8b038d
cris.virtualsource.orcid01b1b8a7-9b04-47c3-bbbc-9009b4f588ea
cris.virtualsource.orcid821dc741-8843-4d53-8e1d-6f543228a740
cris.virtualsource.orcid9f04b13f-f81c-4d48-a5bd-0b2cb5210392
cris.virtualsource.orcidd5d1324e-5341-4c0d-aa41-3c1039907db9
cris.virtualsource.orcidc807a03a-358d-4274-b622-dee889a60454
cris.virtualsource.orcid7f1ede79-794c-4ed6-ba2c-ed759bfbcc5a
cris.virtualsource.orciddb73cf2d-2000-429c-bc92-553a1ef3e876
cris.virtualsource.orcid2d7dd015-fa43-4fbb-89fc-68f144075506
cris.virtualsource.orcidbd265d49-9bfb-424d-adea-35c86526f50d
cris.virtualsource.orcid63d46233-e95e-4a8f-b99d-4404b9546461
dc.contributor.authorEneman, Geert
dc.contributor.authorBrunco, David
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorVincent, Benjamin
dc.contributor.authorFavia, Paola
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorDe Keersgieter, An
dc.contributor.authorMitard, Jerome
dc.contributor.authorLoo, Roger
dc.contributor.authorVeloso, Anabela
dc.contributor.authorRichard, Olivier
dc.contributor.authorBender, Hugo
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorCaymax, Matty
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorCollaert, Nadine
dc.contributor.authorThean, Aaron
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorVincent, Benjamin
dc.contributor.imecauthorFavia, Paola
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorDe Keersgieter, An
dc.contributor.imecauthorMitard, Jerome
dc.contributor.imecauthorLoo, Roger
dc.contributor.imecauthorVeloso, Anabela
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorCaymax, Matty
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorThean, Aaron
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecFavia, Paola::0000-0002-1019-3497
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecDe Keersgieter, An::0000-0002-5527-8582
dc.contributor.orcidimecMitard, Jerome::0000-0002-7422-079X
dc.contributor.orcidimecLoo, Roger::0000-0003-3513-6058
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.accessioned2021-10-21T07:29:37Z
dc.date.available2021-10-21T07:29:37Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22311
dc.source.beginpage225
dc.source.conferenceGraphene, Ge/III-V, and Emerging Materials for Post CMOS Applications 5
dc.source.conferencedate12/05/2013
dc.source.conferencelocationToronto Canada
dc.source.endpage236
dc.title

Stress simulations of Si- and Ge-channel FinFETs for the 14 nm-node and beyond

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
26631.pdf
Size:
334.58 KB
Format:
Adobe Portable Document Format
Publication available in collections: