Publication:

Defect learning methodology applied to microbump process at 20μm pitch and below

Date

2018
Proceedings Paper
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dc.contributor.authorLiebens, Maarten
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorStoerring, M.
dc.contributor.authorHiebert, S.
dc.contributor.authorCross, A.
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.accessioned2021-10-25T22:08:34Z
dc.date.available2021-10-25T22:08:34Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31193
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8373210
dc.source.beginpage10
dc.source.conference2018 29th Annual SemI Advanced Semiconductor Manufacturing Conference - ASMC
dc.source.conferencedate30/04/2018
dc.source.conferencelocationSaratoga Springs, NY USA
dc.source.endpage17
dc.title

Defect learning methodology applied to microbump process at 20μm pitch and below

dc.typeProceedings paper
dspace.entity.typePublication
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