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A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency
Publication:
A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency
Date
2019
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Pantano, Nicolas
;
Van der Plas, Geert
;
Bex, Pieter
;
Nolmans, Philip
;
Velenis, Dimitrios
;
Verhelst, Marian
;
Beyne, Eric
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1960
since deposited on 2021-10-27
1
last week
Acq. date: 2025-10-28
Citations
Metrics
Views
1960
since deposited on 2021-10-27
1
last week
Acq. date: 2025-10-28
Citations