Publication:

A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency

Date

2019
Proceedings Paper
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dc.contributor.authorPantano, Nicolas
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBex, Pieter
dc.contributor.authorNolmans, Philip
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVerhelst, Marian
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorVerhelst, Marian
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecVerhelst, Marian::0000-0003-3495-9263
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T15:25:21Z
dc.date.available2021-10-27T15:25:21Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33734
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811132
dc.source.beginpage607
dc.source.conference2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage613
dc.title

A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency

dc.typeProceedings paper
dspace.entity.typePublication
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