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Thermo-Mechanical Study of Chip-Package Interaction Effects for 3D Stacked IC Technologies
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Thermo-Mechanical Study of Chip-Package Interaction Effects for 3D Stacked IC Technologies
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Date
2014-09-14
Dissertation
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33.85 MB
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ivankovic, Andrej
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