Publication:

Thermo-Mechanical Study of Chip-Package Interaction Effects for 3D Stacked IC Technologies

Date

2014-09-14
Dissertation
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cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.department7ee0a9c0-9be1-4304-b278-ddb11da2cf49
cris.virtualsource.orcid7ee0a9c0-9be1-4304-b278-ddb11da2cf49
dc.contributor.advisorVandepitte, Dirk
dc.contributor.authorIvankovic, Andrej
dc.date.accessioned2026-04-29T12:06:06Z
dc.date.available2026-04-29T12:06:06Z
dc.date.issued2014-09-14
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59230
dc.provenance.editstepusermeghan.oneill@imec.be
dc.title

Thermo-Mechanical Study of Chip-Package Interaction Effects for 3D Stacked IC Technologies

dc.typePHD thesis
dspace.entity.typePublication
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