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Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to Nanosheet
Publication:
Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to Nanosheet
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Date
2024
Proceedings Paper
https://doi.org/10.1109/ISVLSI61997.2024.00020
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chen, Yukai
;
Sankatali, Venkateswarlu
;
Mishra, Subrat
;
Ryckaert, Julien
;
Myers, James
;
Biswas, Dwaipayan
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N/A
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242
since deposited on 2025-01-10
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Acq. date: 2025-12-15
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Metrics
Views
242
since deposited on 2025-01-10
1
last month
Acq. date: 2025-12-15
Citations