Publication:
Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to Nanosheet
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246 since deposited on 2025-01-10
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Acq. date: 2026-04-06
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246 since deposited on 2025-01-10
2last month
2last week
Acq. date: 2026-04-06
Citations