Publication:
Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to Nanosheet
| dc.contributor.author | Chen, Yukai | |
| dc.contributor.author | Sankatali, Venkateswarlu | |
| dc.contributor.author | Mishra, Subrat | |
| dc.contributor.author | Ryckaert, Julien | |
| dc.contributor.author | Myers, James | |
| dc.contributor.author | Biswas, Dwaipayan | |
| dc.contributor.imecauthor | Chen, Yukai | |
| dc.contributor.imecauthor | Sankatali, Venkateswarlu | |
| dc.contributor.imecauthor | Mishra, Subrat | |
| dc.contributor.imecauthor | Ryckaert, Julien | |
| dc.contributor.imecauthor | Myers, James | |
| dc.contributor.imecauthor | Biswas, Dwaipayan | |
| dc.contributor.orcidimec | Chen, Yukai::0000-0003-3378-887X | |
| dc.contributor.orcidimec | Sankatali, Venkateswarlu::0000-0002-1616-6764 | |
| dc.contributor.orcidimec | Mishra, Subrat::0000-0002-1435-3275 | |
| dc.contributor.orcidimec | Biswas, Dwaipayan::0000-0002-1087-3433 | |
| dc.date.accessioned | 2025-04-16T08:05:46Z | |
| dc.date.available | 2025-01-10T17:08:38Z | |
| dc.date.available | 2025-04-16T08:05:46Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ISVLSI61997.2024.00020 | |
| dc.identifier.eisbn | 979-8-3503-5411-9 | |
| dc.identifier.issn | 2159-3469 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45056 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 45 | |
| dc.source.conference | IEEE-Computer-Society Annual Symposium on VLSI (ISVLSI) | |
| dc.source.conferencedate | JUL 01-03, 2024 | |
| dc.source.conferencelocation | Knoxville | |
| dc.source.endpage | 50 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 6 | |
| dc.title | Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to Nanosheet | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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