Publication:
Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations
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819 since deposited on 2023-07-15
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Acq. date: 2026-01-09
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819 since deposited on 2023-07-15
1last month
1last week
Acq. date: 2026-01-09
Citations