Publication:

Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations

Date

2023
Proceedings Paper
https://doi.org/10.1109/IRPS48203.2023.10117955
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dc.contributor.authorVici, Andrea
dc.contributor.authorDegraeve, Robin
dc.contributor.authorRoussel, Philippe
dc.contributor.authorFranco, Jacopo
dc.contributor.authorKaczer, Ben
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorVici, Andrea
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVici, Andrea::0000-0002-3614-9590
dc.contributor.orcidimecDegraeve, Robin::0000-0002-4609-5573
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2024-03-28T08:50:30Z
dc.date.available2023-07-15T17:05:32Z
dc.date.available2024-03-28T08:50:30Z
dc.date.issued2023
dc.identifier.doi10.1109/IRPS48203.2023.10117955
dc.identifier.eisbn978-1-6654-5672-2
dc.identifier.issn1541-7026
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42155
dc.publisherIEEE
dc.source.conference61st IEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedateMAR 26-30, 2023
dc.source.conferencelocationMonterey
dc.source.journalN/A
dc.source.numberofpages7
dc.subject.keywordsTRAP GENERATION
dc.subject.keywordsBREAKDOWN
dc.subject.keywordsSTRESS
dc.subject.keywordsSILC
dc.title

Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations

dc.typeProceedings paper
dspace.entity.typePublication
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