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Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
Publication:
Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
Date
2005-09
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Limaye, Paresh
;
Vandevelde, Bart
;
Verlinden, Bert
;
Vandepitte, Dirk
Journal
Abstract
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1952
since deposited on 2021-10-16
415
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations
Metrics
Views
1952
since deposited on 2021-10-16
415
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations