Publication:
Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
Date
| dc.contributor.author | Limaye, Paresh | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Verlinden, Bert | |
| dc.contributor.author | Vandepitte, Dirk | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-16T02:56:57Z | |
| dc.date.available | 2021-10-16T02:56:57Z | |
| dc.date.issued | 2005-09 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10786 | |
| dc.source.beginpage | 371 | |
| dc.source.conference | SMTA International Annual Conference | |
| dc.source.conferencedate | 25/09/2005 | |
| dc.source.conferencelocation | Chicago, IL USA | |
| dc.source.endpage | 377 | |
| dc.title | Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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