Publication:
Copper-nail TSV technology for 3D-stacked IC integration
Date
| dc.contributor.author | Snoeckx, Koen | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Swinnen, Bart | |
| dc.contributor.imecauthor | Snoeckx, Koen | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Swinnen, Bart | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-16T19:53:00Z | |
| dc.date.available | 2021-10-16T19:53:00Z | |
| dc.date.issued | 2007-05 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/12925 | |
| dc.source.beginpage | 53 | |
| dc.source.endpage | 55 | |
| dc.source.issue | 5 | |
| dc.source.journal | Solid State Technology | |
| dc.source.volume | 50 | |
| dc.title | Copper-nail TSV technology for 3D-stacked IC integration | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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