Publication:

Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00058
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dc.contributor.authorZhang, Boyao
dc.contributor.authorChew, Soon Aik
dc.contributor.authorStucchi, Michele
dc.contributor.authorDewilde, Sven
dc.contributor.authorIacovo, Serena
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorWebers, Tomas
dc.contributor.authorVan Sever, Koen
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorZhang, Boyao
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorDewilde, Sven
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorVan Sever, Koen
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorChew, Soon Aik
dc.contributor.orcidimecZhang, Boyao::0000-0002-7976-0146
dc.contributor.orcidimecStucchi, Michele::0000-0002-7848-0492
dc.contributor.orcidimecDewilde, Sven::0000-0003-2269-2127
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecWitters, Liesbeth::0000-0002-0772-5501
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecBeyer, Gerald::0009-0001-0376-866X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecWebers, Tomas::0009-0003-6285-0908
dc.contributor.orcidimecChew, Soon Aik::0000-0003-3013-4846
dc.date.accessioned2025-04-17T13:57:13Z
dc.date.available2024-12-07T16:57:34Z
dc.date.available2025-04-17T13:57:13Z
dc.date.issued2024
dc.identifier.doi10.1109/ECTC51529.2024.00058
dc.identifier.eisbn979-8-3503-7598-5
dc.identifier.isbn979-8-3503-7599-2
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44946
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage312
dc.source.conferenceIEEE 74th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 28-31, 2024
dc.source.conferencelocationDenver
dc.source.endpage318
dc.source.journalN/A
dc.source.numberofpages7
dc.title

Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch

dc.typeProceedings paper
dspace.entity.typePublication
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