Publication:
Stress and wafer warpage analysis of GaN thin film induced by transfer bonding process on 200mm Si substrate
Date
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Pham, Nga | |
| dc.contributor.author | Rosmeulen, Maarten | |
| dc.contributor.author | Soussan, Philippe | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Pham, Nga | |
| dc.contributor.imecauthor | Rosmeulen, Maarten | |
| dc.contributor.imecauthor | Soussan, Philippe | |
| dc.contributor.orcidimec | Rosmeulen, Maarten::0000-0002-3663-7439 | |
| dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
| dc.date.accessioned | 2021-10-21T09:32:05Z | |
| dc.date.available | 2021-10-21T09:32:05Z | |
| dc.date.issued | 2013 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/22719 | |
| dc.source.conference | 14th Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE | |
| dc.source.conferencedate | 15/04/2013 | |
| dc.source.conferencelocation | Wroclaw Poland | |
| dc.title | Stress and wafer warpage analysis of GaN thin film induced by transfer bonding process on 200mm Si substrate | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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