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Using water structuring by ions to address pattern loading in wet HF-based oxide recess etch
Publication:
Using water structuring by ions to address pattern loading in wet HF-based oxide recess etch
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Date
2023
Journal article
https://doi.org/10.1016/j.mee.2023.112058
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vereecke, Guy
;
De Coster, Hanne
;
Dochain, Denis
;
Nurekeyeva, Kunsulu
;
Conlan, Shona
;
Nsimba, Anthony
;
Wostyn, Kurt
;
Altamirano Sanchez, Efrain
Journal
MICROELECTRONIC ENGINEERING
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1083
since deposited on 2023-08-10
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Acq. date: 2025-12-15
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Metrics
Views
1083
since deposited on 2023-08-10
2
last month
Acq. date: 2025-12-15
Citations