Publication:
Influence of dielectric materials and via geometry on the thermomechanical behavior of silicon through interconnects
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1853 since deposited on 2021-10-16
1last month
Acq. date: 2026-04-06
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Statistics
Views
1853 since deposited on 2021-10-16
1last month
Acq. date: 2026-04-06
Citations