Publication:
Influence of dielectric materials and via geometry on the thermomechanical behavior of silicon through interconnects
Date
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Labie, Riet | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Labie, Riet | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-16T01:45:09Z | |
| dc.date.available | 2021-10-16T01:45:09Z | |
| dc.date.issued | 2005 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10504 | |
| dc.source.beginpage | 9 | |
| dc.source.conference | 10th Annual SMTA Pan Pacific Microelectronics Symposium & Exhibition | |
| dc.source.conferencedate | 25/01/2005 | |
| dc.source.conferencelocation | Kauai, HI USA | |
| dc.source.endpage | 14 | |
| dc.title | Influence of dielectric materials and via geometry on the thermomechanical behavior of silicon through interconnects | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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