Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Articles
Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
Publication:
Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
Date
2003
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chandrasekhar, Arun
;
Vandevelde, Bart
;
Driessens, Evelien
;
Beyne, Eric
;
De Raedt, Walter
;
Pieters, Philip
;
Nauwelaers, Bart
;
Van Puymbroeck, Jef
Journal
IEEE Trans. Electronics Packaging Manufacturing
Abstract
Description
Metrics
Views
2048
since deposited on 2021-10-15
Acq. date: 2025-10-26
Citations
Metrics
Views
2048
since deposited on 2021-10-15
Acq. date: 2025-10-26
Citations