Publication:

Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification

Date

2003
Journal article
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dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDriessens, Evelien
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorPieters, Philip
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorVan Puymbroeck, Jef
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.accessioned2021-10-15T04:08:01Z
dc.date.available2021-10-15T04:08:01Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7306
dc.source.beginpage54
dc.source.endpage67
dc.source.issue1
dc.source.journalIEEE Trans. Electronics Packaging Manufacturing
dc.source.volume26
dc.title

Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification

dc.typeJournal article
dspace.entity.typePublication
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