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Gate stack thermal stability and PBTI reliability challenges for 3D sequential integration: demonstration of a suitable gate stack for top and bottom tier nMOS

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1989 since deposited on 2021-10-24
1last month
Acq. date: 2026-05-17

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1989 since deposited on 2021-10-24
1last month
Acq. date: 2026-05-17

Citations