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Gate stack thermal stability and PBTI reliability challenges for 3D sequential integration: demonstration of a suitable gate stack for top and bottom tier nMOS
Publication:
Gate stack thermal stability and PBTI reliability challenges for 3D sequential integration: demonstration of a suitable gate stack for top and bottom tier nMOS
Date
2017
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Franco, Jacopo
;
Witters, Liesbeth
;
Vandooren, Anne
;
Arimura, Hiroaki
;
Sioncke, Sonja
;
Putcha, Vamsi
;
Vais, Abhitosh
;
Xie, Qi
;
Givens, Michael
;
Tang, Fu
;
Jiang, X.
;
Subirats, Alexandre
;
Vaisman Chasin, Adrian
;
Ragnarsson, Lars-Ake
;
Kaczer, Ben
;
Linten, Dimitri
;
Collaert, Nadine
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1982
since deposited on 2021-10-24
Acq. date: 2025-10-23
Citations
Metrics
Views
1982
since deposited on 2021-10-24
Acq. date: 2025-10-23
Citations