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Edge trimming for wafer-to-wafer 3D integration
Publication:
Edge trimming for wafer-to-wafer 3D integration
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Date
2016
Proceedings Paper
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33017.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Inoue, Fumihiro
;
Visker, Jakob
;
Jourdain, Anne
;
Moeller, Berthold
;
Yokoyama, Kaori
;
Peng, Lan
;
Kosemura, Daisuke
;
De Wolf, Ingrid
;
Rebibis, Kenneth June
;
Miller, Andy
;
Beyne, Eric
;
Sleeckx, Erik
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2040
since deposited on 2021-10-23
3
last month
Acq. date: 2025-12-10
Citations