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Edge trimming for wafer-to-wafer 3D integration

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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorVisker, Jakob
dc.contributor.authorJourdain, Anne
dc.contributor.authorMoeller, Berthold
dc.contributor.authorYokoyama, Kaori
dc.contributor.authorPeng, Lan
dc.contributor.authorKosemura, Daisuke
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorSleeckx, Erik
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.date.accessioned2021-10-23T11:28:10Z
dc.date.available2021-10-23T11:28:10Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26766
dc.source.beginpageP3D-03
dc.source.conferenceMaterials for Advanced Metallization Conference - MAM
dc.source.conferencedate20/03/2015
dc.source.conferencelocationBrussels Belgium
dc.title

Edge trimming for wafer-to-wafer 3D integration

dc.typeProceedings paper
dspace.entity.typePublication
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