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Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer
Publication:
Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer
Date
2011
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Nguyen, Hai P.
;
Su, Jiale
;
Vullers, Ruud
;
Vereecken, Philippe
;
Fransaer, Jan
Journal
Journal of Materials Research
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1906
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations
Metrics
Views
1906
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations