Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer

dc.contributor.author	Nguyen, Hai P.
dc.contributor.author	Su, Jiale
dc.contributor.author	Vullers, Ruud
dc.contributor.author	Vereecken, Philippe
dc.contributor.author	Fransaer, Jan
dc.contributor.imecauthor	Vereecken, Philippe
dc.contributor.orcidimec	Vereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned	2021-10-19T16:40:59Z
dc.date.available	2021-10-19T16:40:59Z
dc.date.issued	2011
dc.identifier.issn	0884-2914
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/19479
dc.source.beginpage	1953
dc.source.endpage	1957
dc.source.issue	15
dc.source.journal	Journal of Materials Research
dc.source.volume	26
dc.title	Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer
dc.type	Journal article
dspace.entity.type	Publication
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