Publication:

Aluminide intermetallics for advanced interconnect metallization: thin film studies

Date

2021
Proceedings Paper
https://doi.org/10.1109/IITC51362.2021.9537441
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2021041350_Soulie.pdf 501.75 KB

Author(s)

Soulie, Jean-Philippe  
;
Tokei, Zsolt  
;
Swerts, Johan  
;
Adelmann, Christoph  

Journal

IEEE

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334 since deposited on 2022-05-05
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1661 since deposited on 2022-05-05
Acq. date: 2026-06-23

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