Publication:

Aluminide intermetallics for advanced interconnect metallization: thin film studies

Date

2021
Proceedings Paper
https://doi.org/10.1109/IITC51362.2021.9537441
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Files

2021041350_Soulie.pdf 501.75 KB

Author(s)

Soulie, Jean-Philippe
;
Tokei, Zsolt  
;
Swerts, Johan  
;
Adelmann, Christoph  

Journal

IEEE

Abstract

Description

Metrics

Downloads

157 since deposited on 2022-05-05
Acq. date: 2025-10-27

Views

1647 since deposited on 2022-05-05
Acq. date: 2025-10-27

Citations

Metrics

Downloads

157 since deposited on 2022-05-05
Acq. date: 2025-10-27

Views

1647 since deposited on 2022-05-05
Acq. date: 2025-10-27

Citations