Publication:

Aluminide intermetallics for advanced interconnect metallization: thin film studies

Date

2021
Proceedings Paper
https://doi.org/10.1109/IITC51362.2021.9537441
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dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorTokei, Zsolt
dc.contributor.authorSwerts, Johan
dc.contributor.authorAdelmann, Christoph
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.date.accessioned2022-07-08T10:01:13Z
dc.date.available2022-05-05T02:17:26Z
dc.date.available2022-07-05T12:58:49Z
dc.date.available2022-07-08T10:01:13Z
dc.date.issued2021
dc.identifier.doi10.1109/IITC51362.2021.9537441
dc.identifier.eisbn978-1-7281-7632-1
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39739
dc.publisherIEEE
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC)
dc.source.conferencedateJUL 06-09, 2021
dc.source.conferencelocationonline
dc.source.journalIEEE
dc.source.numberofpages3
dc.title

Aluminide intermetallics for advanced interconnect metallization: thin film studies

dc.typeProceedings paper
dspace.entity.typePublication
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