Publication:
Aluminide intermetallics for advanced interconnect metallization: thin film studies
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0003-3545-3424 | |
| cris.virtual.orcid | 0000-0001-7547-7194 | |
| cris.virtual.orcid | 0000-0002-4831-3159 | |
| cris.virtual.orcid | 0000-0002-5956-6485 | |
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| cris.virtualsource.orcid | 5345513e-14d5-47e9-a494-1dda4ed18864 | |
| cris.virtualsource.orcid | 5afcb429-ac38-4c13-8422-3088287ba9bd | |
| cris.virtualsource.orcid | 3e839b18-b9e5-46f9-95d4-760837031f7a | |
| cris.virtualsource.orcid | c1bbf7c6-fe00-4d3e-9b77-5ac76d18c50a | |
| dc.contributor.author | Soulie, Jean-Philippe | |
| dc.contributor.author | Tokei, Zsolt | |
| dc.contributor.author | Swerts, Johan | |
| dc.contributor.author | Adelmann, Christoph | |
| dc.contributor.imecauthor | Soulie, Jean-Philippe | |
| dc.contributor.imecauthor | Tokei, Zsolt | |
| dc.contributor.imecauthor | Swerts, Johan | |
| dc.contributor.imecauthor | Adelmann, Christoph | |
| dc.contributor.orcidimec | Soulie, Jean-Philippe::0000-0002-5956-6485 | |
| dc.contributor.orcidimec | Adelmann, Christoph::0000-0002-4831-3159 | |
| dc.date.accessioned | 2022-07-08T10:01:13Z | |
| dc.date.available | 2022-05-05T02:17:26Z | |
| dc.date.available | 2022-07-05T12:58:49Z | |
| dc.date.available | 2022-07-08T10:01:13Z | |
| dc.date.issued | 2021 | |
| dc.identifier.doi | 10.1109/IITC51362.2021.9537441 | |
| dc.identifier.eisbn | 978-1-7281-7632-1 | |
| dc.identifier.issn | 2380-632X | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39739 | |
| dc.publisher | IEEE | |
| dc.source.conference | IEEE International Interconnect Technology Conference (IITC) | |
| dc.source.conferencedate | JUL 06-09, 2021 | |
| dc.source.conferencelocation | online | |
| dc.source.journal | IEEE | |
| dc.source.numberofpages | 3 | |
| dc.title | Aluminide intermetallics for advanced interconnect metallization: thin film studies | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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| Publication available in collections: |